Glass Cutting
Glass Cutting
Laser Marking
Glass Drilling
Glass Cutting
PCB Cutting
PCB Cutting
Carbon Fiber Cutting
Pangaea has an in-house Industrial Lasers Application Lab in Shenzhen,
there is an experienced team of technical staff in the lab with installations of
high quality laser sources, testing platform and equipment. We are capable of
making recommendations to customers on the laser technology direction and
develop suitable applications and solutions that can meet customer’s
requirements.
Picosecond/Femtosecond Laser
Glass and brittle transparent material cutting
Fine micromachining, high process control and no heat generation
include surface structuring
Metal trace cutting, photoresist removal or color filter for repair of
LCD panels without HAZ
Scribing and dicing of OLED and LED
Nanosecond Q-Switched DPSS
Apply in micro-processing of semiconductor wafers
Cutting of sapphire and other substrates of OLEDs and LED
Microvia drilling and cutting of flex board or glass-based PCB
Drilling, cutting and structuring of ceramics, thin-film patterning and
selective removal
Low Power CW Lasers
Apply in metrology, biotechnology and research
Manufacturers